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1 features ? low voltage and standard voltage operation: 2.7 (v cc = 2.7v to 5.5v) internally organized 128 x 8 two-wire serial interface bidirectional data transfer protocol 1 mhz (2.7v, 5v) compatibility 4-byte page write mode self-timed write cycle (5 ms max) high reliability ? endurance: 1 million write cycles ? data retention: 100 years automotive grade and lead-free/ halogen-free devices available 8-lead pdip, 8-lead jedec soic, 8-lead tssop packages description the at24c11 provides 1024 bits of serial electrically erasable and programmable read only memory (eeprom) organized as 128 words of 8 bits each. the device is optimized for use in many automotive applications where low power and low voltage operation are essential. the at24c11 is available in space saving 8-lead pdip, 8-lead jedec soic, and 8-lead tssop packages and is accessed via a two-wire serial interface. in addition, the entire family is available in 2.7v (2.7v to 5.5v). table 1. pin configuration pin name function nc no connect sda serial data scl serial clock input test test input (gnd or vcc) two-wire automotive temperature serial eeprom 1k (128 x 8) at24c11 rev. 5093c?seepr? 09 /06 8-lead pdip 1 2 3 4 8 7 6 5 nc nc nc gnd vcc test scl sda 8-lead soic 1 2 3 4 8 7 6 5 nc nc nc gnd vcc test scl sda 8-lead tssop 1 2 3 4 8 7 6 5 nc nc nc gnd vcc test scl sda
2 at24c11 5093c?seepr? 09/06 figure 1. block diagram absolute maximum ratings* operating temperature..................................?55 c to +125 c *notice: stresses beyond those listed under ?absolute maximum ratings? may cause permanent dam- age to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. storage temperature .....................................?65 c to +150 c voltage on any pin with respect to ground .................................... ?1.0v to +7.0v maximum operating voltage .......................................... 6.25v dc output current........................................................ 5.0 ma
3 at24c11 5093c?seepr? 09/06 pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negat ive edge clock data out of each device. serial data (sda): the sda pin is bidirectional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open collector devices. memory organization at24c11, 1k serial eeprom: internally organized with 32 pages of 4 bytes each. the 1k requires a 7-bit data word address for random word addressing. note: 1. v il min and v ih max are reference only and are not tested. table 2. pin capacitance applicable over recommended operating range from t a = 25 c, f = 1.0 mhz, v cc = +2.7v to +5.5v symbol test condition max units condition c i/o input/output capacitance (sda) 8 pf v i/o = 0v c in input capacitance (a0, a1, a2, scl) 6 pf v in = 0v table 3. dc characteristics applicable over recommended operating range from: t ae = ? 40 c to +125 c, v cc = +2.7v to +5.5v (unless otherwise noted) symbol parameter test co ndition min typ max units v cc1 supply voltage 2.7 5.5 v v cc2 supply voltage 4.5 5.5 v i cc supply current v cc = 5.0v read at 100 khz 0.4 1.0 ma i cc supply current v cc = 5.0v write at 100 khz 2.0 3.0 ma i sb1 standby current v cc = 1.8v v in = v cc or v ss 0.6 3.0 a i sb2 standby current v cc = 2.5v v in = v cc or v ss 1.4 4.0 a i sb3 standby current v cc = 2.7v v in = v cc or v ss 1.6 4.0 a i sb4 standby current v cc = 5.0v v in = v cc or v ss 8.0 18.0 a i li input leakage current v in = v cc or v ss 0.10 3.0 a i lo output leakage current v out = v cc or v ss 0.05 3.0 a v il input low level (1) ?0.6 v cc 0.3 v v ih input high level (1) v cc 0.7 v cc + 0.5 v v ol2 output low level v cc = 3.0v i ol = 2.1 ma 0.4 v v ol1 output low level v cc = 1.8v i ol = 0.15 ma 0.2 v
4 at24c11 5093c?seepr? 09/06 note: 1. this parameter is ensured by characterization only. table 4. ac characteristics applicable over recommended operating range from t a = ? 40 c to +125 c, v cc = +2.7v to +5.5v, cl = 1 ttl gate and 100 pf (unless otherwise noted) symbol parameter 2.7v, 5.0v units min max f scl clock frequency, scl 1000 khz t low clock pulse width low 0.4 s t high clock pulse width high 0.4 s t aa clock low to data out valid 0.05 0.55 s t buf time the bus must be free before a new transmission can start (1) 0.5 s t hd.sta start hold time 0.25 s t su.sta start set-up time 0.6 s t hd.dat data in hold time 0 s t su.dat data in set-up time 100 ns t r inputs rise time (1) 0.3 s t f inputs fall time (1) 100 ns t su.sto stop set-up time 0.25 s t dh data out hold time 50 ns t wr write cycle time 5 ms endurance (1) 5.0v, 25c, page mode 1m write cycles
5 at24c11 5093c?seepr? 09/06 device operation clock and data transitions: the sda pin is normally pulled high with an exter- nal device. data on the sda pin may change only during scl low time periods (see figure 4 on page 6). data c hanges during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (see figure 5 on page 7). stop condition: a low-to-high transition of sda with scl high is a stop condition which terminates all communications. after a read sequence, the stop command will place the eeprom in a standby power mode (see figure 5 on page 7). acknowledge: all addresses and data words are serially transmitted to and from the eeprom in 8-bit words. any device on the system bus receiving data (when com- municating with the eeprom) must pull the sda bus low to acknowledge that it has successfully received each wo rd. this must happen during the ninth clock cycle after each word received and after all other system devices have freed the sda bus. the eeprom will likewise acknowledge by pulling sd a low after receivin g each add ress or data word (see figure 6 on page 7). standby mode: the at24c11 features a low power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the stop bit and the completion of any internal operations. memory reset: after an interruption in protocol, power loss or system reset, any 2- wire part can be reset by following these steps: (a) clock up to 9 cycles, (b) look for sda high in each cycle while scl is high and then (c) create a start condition as sda is high.
6 at24c11 5093c?seepr? 09/06 figure 2. bus timing scl: serial clock, sda: serial data i/o figure 3. write cycle timing scl: serial clock, sda: serial data i/o note: 1. the write cycle time t wr is the time from a valid stop condition of a write s equence to the end of the internal clear/write cycle. figure 4. data validity t wr (1) stop condition start condition wordn ack 8th bit scl sda
7 at24c11 5093c?seepr? 09/06 figure 5. start and stop definition figure 6. output acknowledge
8 at24c11 5093c?seepr? 09/06 write operations byte write: following a start condition, a write operation requires a 7-bit data word address and a low write bit. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8- bit data word, the eeprom will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. at this time the eeprom enters an internally-tim ed write cycle to the nonvolatile memory. all inputs are disabled during this write cycle, t wr , and the eeprom will not re spond until the write is complete (see refer to figure 7 on page 9). page write: the at24c11 is capable of a 4-byte page write. a page write is initiated the same as a byte write but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcontroller can transmit up to three more data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (see figure 8 on page 9). the data word address lower 2 bits are internally incremented following the receipt of each data word. the higher five data word address bits are not incremented, retaining the memory page row location. when the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. if more than four data words are transmitted to the eeprom, the data word address will ?roll over? and previous data w ill be overwritten. access to 1 additional page is available upon request. acknowledge polling: once the internally-timed write cycle has started and the eeprom inputs are disabl ed, acknowledge polling can be in itiated. this involves send- ing a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero allowing the read or write sequence to continue. read operations read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. there are two read operations: byte read and sequential read. byte read: a byte read is initiated with a star t condition followed by a 7-bit data word address and a high read bit. the at24c11 will respond with an acknowledge and then serially output 8 data bits. the microcontroller does not respond with a zero but does generate a following stop condition (see figure 9 on page 9). sequential read: sequential reads are initiated the same as a byte read. after the microcontroller receives an 8-bit data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word addr ess will ?roll over? and the sequ ential read will continue. the sequential read operation is terminated when the microcontroller does not respond with an input zero but does generate a following stop condition (see figure 10 on page 9).
9 at24c11 5093c?seepr? 09/06 figure 7. byte write figure 8. page write figure 9. byte read figure 10. sequential read
10 at24c11 5093c?seepr? 09/06 notes: 1. ?q? designates green package + rohs compliant. 2. for 2.7v devices used in the 4.5v to 5.5v range, please refer to performance values in the ac and dc characteristics tables. at24c11 ordering information ordering code package operation range at24c11-10pe-2.7 at24c11n-10se-2.7 at24c11-10te-2.7 8p3 8s1 8a2 automotive temperature (?40 c to 85 c) at24c11-10pq-2.7 (1) at24c11n-10sq-2.7 (1) at24c11-10tq-2.7 (1) 8p3 8s1 8a2 lead-free/halogen-free/ automotive temperature (?40 c to 85 c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 0.170" wide, thin shrink small outline package (tssop) options ? 2.7 low-voltage (2.7v to 5.5v)
11 at24c11 5093c?seepr? 09/06 packaging information 8p3 ? pdip 2 3 25 orch a rd p a rkw a y sa n jo s e, ca 951 3 1 title drawing no. r rev. 8 p 3 , 8 -le a d, 0. 3 00" wide body, pl as tic d ua l in-line p a ck a ge (pdip) 01/09/02 8 p 3 b d d1 e e1 e l b 2 b a2 a 1 n ea c b3 4 plc s top view s ide view end view common dimen s ion s (unit of me asu re = inche s ) s ymbol min nom max note note s : 1. thi s dr a wing i s for gener a l inform a tion only; refer to jedec dr a wing m s -001, v a ri a tion ba for a ddition a l inform a tion. 2. dimen s ion s a a nd l a re me asu red with the p a ck a ge s e a ted in jedec s e a ting pl a ne g au ge g s - 3 . 3 . d, d1 a nd e1 dimen s ion s do not incl u de mold fl as h or protr us ion s . mold fl as h or protr us ion s s h a ll not exceed 0.010 inch. 4. e a nd ea me asu red with the le a d s con s tr a ined to b e perpendic u l a r to d a t u m. 5. pointed or ro u nded le a d tip s a re preferred to e as e in s ertion. 6. b 2 a nd b3 m a xim u m dimen s ion s do not incl u de d a m ba r protr us ion s . d a m ba r protr us ion s s h a ll not exceed 0.010 (0.25 mm). a 0.210 2 a2 0.115 0.1 3 0 0.195 b 0.014 0.01 8 0.022 5 b 2 0.045 0.060 0.070 6 b3 0.0 3 0 0.0 3 9 0.045 6 c 0.00 8 0.010 0.014 d 0. 3 55 0. 3 65 0.400 3 d1 0.005 3 e 0. 3 00 0. 3 10 0. 3 25 4 e1 0.240 0.250 0.2 8 0 3 e 0.100 b s c ea 0. 3 00 b s c 4 l 0.115 0.1 3 0
12 at24c11 5093c?seepr? 09/06 8s1 ? jedec soic 1150 e. cheyenne mtn. blvd. colorado springs, co 80906 title drawing no. r rev. note: 10/7/03 8s1 , 8-lead (0.150" wide body), plastic gull wing small outline (jedec soic) 8s1 b common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 these drawings are for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. a 1.35 ? 1.75 b 0.31 ? 0.51 c 0.17 ? 0.25 d 4.80 ? 5.00 e1 3.81 ? 3.99 e 5.79 ? 6.20 e 1.27 bsc l 0.40 ? 1.27 ? 0? ? 8? ? top view end view side view e b d a a1 n e 1 c e1 l
13 at24c11 5093c?seepr? 09/06 8a2 ? tssop 2325 orchard parkway san jose, ca 95131 title drawing no. r rev. 5/30/02 common dimensions (unit of measure = mm) symbol min nom max note d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 a ? ? 1.20 a2 0.80 1.00 1.05 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref 8a2 , 8-lead, 4.4 mm body, plastic thin shrink small outline package (tssop) notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, tolerances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07 mm. 5. dimension d and e1 to be determined at datum plane h. 8a2 b side view end view top view a2 a l l1 d 1 2 3 e1 n b pin 1 indicator this corner e e
14 at24c11 5093c?seepr? 09/06 revision history doc. rev. comments 5093c revision history implemented; removed ?preliminary? status from datasheet.
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